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中南大学学报(自然科学版)

Journal of Central South University

第41卷    第6期    总第196期    2010年12月

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文章编号:1672-7207(2010)06-2149-07
NiFe2O4/Cu金属陶瓷与金属的磷酸盐黏接特性
张雷,陈孜,李志友,周科朝,李超

(中南大学 粉末冶金国家重点实验室,湖南 长沙,410083)

摘 要: 采用磷酸铝铬为胶黏剂,NiFe2O4陶瓷粉与Cu-Ag合金粉为填充料,CuO为固化剂,对NiFe2O4/Cu金属陶瓷与45#钢的黏接特性进行研究。通过测试黏接接头强度、分析黏接界面和黏接层的显微结构和物相组成等研究胶黏剂浓度和处理工艺对黏接接头室温和高温黏接性能的影响。实验结果表明,于120 ℃固化和1 000 ℃热处理后的黏接界面结合紧密,于120 ℃固化后的室温拉剪强度达53.88 MPa,于1 000 ℃热处理后的室温拉剪强度为25.43 MPa;700 ℃时试样拉剪强度达29.25 MPa,800 ℃时接头的拉剪强度降为6.54 MPa;胶黏剂的软化及熔化是导致800 ℃时接头高温黏接强度降低的一个主要原因,同时,高温下磷酸盐分解物的挥发及其物相反应导致黏接层疏松、多孔。

 

关键字: 磷酸铝铬胶黏剂;黏接强度;黏接界面;黏接层

Phosphate bonding characteristic of NiFe2O4/Cu cermet and metal
ZHANG Lei, CHEN Zi, LI Zhi-you, ZHOU Ke-chao, LI Chao

State Key Laboratory of Powder Metallurgy, Central South University, Changsha 410083, China

Abstract:An adhesive bonding technology of NiFe2O4/Cu cermet and 45# steel was investigated using aluminum chromium phosphate as binder, CuO as curing agents and NiFe2O4 ceramic powder and Cu-Ag powder as fillers. Strength of bonded joint, microstructure of bonding interface and phase composition of the adhesive layers were characterized. The effects of binders and process on room-temperature and high temperature bonding performance were studied. The results show that the consistence of binders and treatment technologies are critical to adhesion performance of bonded joint at room-temperature and high temperature. Bonding interface combines closely after curing at 120 ℃ and heat treatment at 1 000 ℃. After curing at 120 ℃, the room temperature tensile shearing strength is 53.88 MPa. Tensile shearing strengths of bonded joint are 25.43 MPa after heat treatment at 1 000 ℃, 29.25 MPa at 700 ℃ and 6.54 MPa at 800 ℃, respectively. Softening and melting of binders behavior at 800 ℃ is responsible for the decrease in strength of bonded joint. Volatile of decomposition products and phase reaction also cause porous adhesive layer which weakens the strength.

 

Key words: aluminium chromium phosphate binder; bonding strength; bonding interface; adhesive layer

中南大学学报(自然科学版)
  ISSN 1672-7207
CN 43-1426/N
ZDXZAC
中南大学学报(英文版)
  ISSN 2095-2899
CN 43-1516/TB
JCSTFT
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